DOC Opens $300M CHIPS National Advanced Packaging Manufacturing Program Funding Opportunity
Eligible applicants: domestic organizations; accredited higher education institutions; and state, local, territorial, and Tribal governments. Applications are due July 3, 2024
Announcement Type: Notice of Funding Opportunity
Opportunity: CHIPS National Advanced Packaging Manufacturing Program (NAPMP)
Overview and Eligible Uses: The CHIPS NAPMP aims to establish and accelerate domestic capacity for advanced packaging substrates and substrate materials related to the production of semiconductors. Advanced packaging significantly improves chip function, performance, and efficiency relative to conventional packaging.
The NAPMP will fund R&D activities that address technological challenges related to advanced packaging, including design and assembly, power supply and heat management, test and repair, and reliability.
The six priority research investment areas include:
Materials and substrates
Equipment, tools, and processes
Power delivery and thermal management
Photonics and connectors that communicate with the outside world
A chiplet ecosystem
Co-design of multi-chiplet systems with automated tools
This is the third NOFO released by the CHIPS for America office and the first focused on R&D.
Amount: A total of $300M is available, with awards up to $100M
Award Type: Cooperative agreements (other transaction agreements as appropriate)
Eligible Applicants: Eligible applicants include domestic for-profit and nonprofit organizations; accredited domestic higher education institutions; and state, local, territorial, and Tribal governments.
Key Dates: Mandatory concept papers are due April 12, 2024. Full proposals are due July 3, 2024.
Key Links:
For a full list of currently available grant programs under the Infrastructure Law and other helpful tools, take a look at our Helpful Resources page.
This tracker will continue to send updates when new funding opportunities are announced.