DOC Announces NOI $1.6B for CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development
Anticipated due date for concept papers approximately 60 days after the date of NOFO publication.
Announcement Type: Notice of Intent (NOI)
Opportunity: CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development
Overview and Eligible Uses: The CHIPS Research and Development Office (CHIPS R&D) plans to announce a Notice of Funding Opportunity (NOFO) to support new research and development (R&D) activities aimed at establishing and accelerating domestic capacity for semiconductor advanced packaging. This initiative, part of the National Advanced Packaging Manufacturing Program (NAPMP), seeks to drive U.S. leadership in advanced packaging and develop the necessary technology and skilled workforce for packaging manufacturing in the United States. The goal is to create a vibrant, self-sustaining, and profitable domestic packaging industry within a decade, bolstered by CHIPS manufacturing incentives.
The NOFO will focus on enabling innovative new advanced packaging flows suitable for adoption by U.S. industry through R&D. Eligible uses include basic and applied research, development of advanced packaging manufacturing-scale equipment and processes, design and demonstration of prototypes, and preparation for commercial viability and domestic manufacturing. Additionally, workforce education and training, as well as pilot-level fabrication, will be supported. While co-investment is not required, preference will be given to applications with credible co-investment commitments.
Amount: CHIPS R&D plans to distribute up to $1,600,000,000 in cooperative agreements and other transaction agreements, with each award potentially receiving up to $150,000,000 in federal funds. Multiple awards for projects of varying scope and funding amounts are anticipated under this NOFO, with each award having a performance period of up to 5 years.
Award Type: Discretionary
Eligible Applicants:
For-profit organizations
Non-profit organizations
Accredited institutions of higher education, including community and technical colleges and minority-serving institutions
State, local, territorial, and Tribal governments
Federally Funded Research and Development Centers (FFRDCs) as subrecipients
Foreign organizations as sub-subrecipients or contractors (subject to CHIPS R&D approval)
Note: All lead applicants must be domestic entities, incorporated in the United States (including U.S. territories) with their principal place of business in the United States.
Key Dates: Anticipated due date for concept papers approximately 60 days after the date of NOFO publication.
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