Department of Commerce Issues Expanded NOFO for Commercial Fabrication Facilities Under the CHIPS ACT
Eligible applicants: * manufacturers, nonprofits, forprofits. Applications are due TBA
Announcement Type: Scope Expansion
Opportunity:CHIPS Incentives Program – Commercial Fabrication Facilities
Overview and Eligible Uses: The eligible uses for funding under the amended notice of funding opportunity include upstream supply chain projects related to wafer manufacturing and semiconductor materials and manufacturing equipment facilities. Here are the definitions of key terms provided in the amended NOFO:
Wafer manufacturing facilities: These facilities involve the production of wafers using materials such as silicon, silicon carbide, and gallium nitride.
Semiconductor materials facilities: These facilities are engaged in the manufacture, production, growth, or extraction of chemicals, gases, or other raw and intermediate materials used in semiconductor manufacturing. This includes substances like photoresists, ancillaries, and sputter targets.
Semiconductor manufacturing equipment: This category includes specialized equipment that plays an integral role in semiconductor production. Examples of such equipment include deposition tools, etching machines, lithography systems, wafer slicing and dicing equipment, inspection and measuring devices, and ion implantation and diffusion/oxidation furnaces.
Under the amended NOFO, large supply chain projects and wafer manufacturers can utilize the same application process as commercial fabrication facilities, eliminating the need for a separate funding opportunity for upstream supply chain projects.
Amount: The amounts available under the CHIPS Act are as follows:
for CHIPS Direct Funding, up to $38.22 billion
for CHIPS Loans and CHIPS Loan Guarantees, up to $75 billion in direct loan or guaranteed principal
Award Type: Discretionary grant
Eligible Applicants: An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to fabrication, assembly, testing, advanced packaging, or production of semiconductors, materials used to manufacture semiconductors, or semiconductor manufacturing equipment
Key Dates:
Pre-applications for current-generation, mature-node, and back-end production facilities are due June 26, 2023.
For potential applications for semiconductor materials and manufacturing equipment facilities for which the capital investment equals or exceeds $300 million, pre-applications (recommended) will be accepted on a rolling basis beginning September 1, 2023, and full applications will be accepted on a rolling basis beginning October 23, 2023.
Key Links:
For a full list of currently available grant programs under the Infrastructure Law and other helpful tools, take a look at our Helpful Resources page.
This tracker will continue to send updates when new funding opportunities are announced.